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PEOPLE
Principal Investigators at MIT and Collaborators in Singapore:
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MIT
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Singapore
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- Adams, Martin David
- Chan, Eng Soon
- Cheong, Hin Fatt
- Chitre, Mandar A.
- Chua, Hock Chye Lloyd
- Koh, Tieh-Yong
- Law, Wing-Keung Adrian
- Lim, Hock Beng
- Lo, Yat-Man Edmond
- Miao, Jianmin
- Mueller-Wittig, Karl Wolfgang
- Roth, Matthias
- Seah, Harry
- Shuy, Eng Ban
- Wijesoma, Wijerupage Sardha
- Wittkopf, Stephen K.
- Wong, Nyuk Hien
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Senior Staff and Postdocs:
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MIT
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Singapore
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- Research Scientists:
- Research Associates:
- Postdoctoral Associates:
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- Program Manager:
- Research Engineers:
- Postdoctoral Associates:
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Graduate Students:
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MIT
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Singapore
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- Charlie Ambler
- Julie Chalfant
- Jose A. Dominguez-Caballero
- Vicente Fernandez
- Terianne Hall
- Stephen Hou
- Satoshi Takahashi
- Laura Waller
- ... to be added ...
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- Rebecca Gianotti
- Kam Shing Leung
- Rebecca Neumann
- ... to be added ...
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Miao, Jianmin
Associate Professor, School of Mechanical and Aerospace Engineering
Director, Micromachines Centre - http://mmc.mpe.ntu.edu.sg
Room: N3.2-2-20, Nanyang Technological University (NTU), Singapore 639798
Tel: (65)-67906038, Fax: (65)-67906995, E-mail: mjmmiao@ntu.edu.sg
Academic Preparation:
- Tongji U Shanghai (Electric and Electronic Eng.), B.E., 1985
- Darmstadt U of Technol. (DUT) (Electric and IT. Eng.), Dipl.-Ing., 1991
- Darmstadt U of Technol. (DUT) (Electric and IT. Eng.), Dr.-Ing., 1996
Appointments:
- Associate Professor, School Mech. Aerosp. Eng., NTU, 2004-Present
- Assistant Professor, School Mech. Aerosp. Eng., NTU, 1998-2003
- Director, Micromachines Centre NTU, 1998-Present
- Head, R&D Dept., Lectret, 1996-1998
- Research and Teaching Staff, Dept. Electric and IT. Eng., DUT, 1991-1996
- Visiting Professorship Appointments:
- Visiting Senior Scientist, Penn State U, 2002
- Visiting Professor, ESIEEE, 2004
Honors:
- Distinguished PhD thesis, Darmstadt University of Technology (Germany), 1996
Four Recent Publications:
- Ting Xu, Zhihong Wang, Jianmin Miao, Xiaofeng Chen and C. M. Tan, "Aligned carbon nanotubes for through-wafer interconnects," Applied Physics Letters 91, No. 4, Art. No. 042108 (2007)
- Luhua Xu, Pradeep Dixit, Jianmin Miao, John H. L. Pang, Xi Zhang, K. N. Tu and Robert Preisser, "Through-wafer electroplated copper interconnect with ultra-fine grains and high density of nano-twins", Applied Physics Letters 90, No. 3, Art. No. 033111 (2007)
- Chee Wee Tan and Jianmin Miao, "Analytical modeling of bulk-micromachined condenser microphones", Journal of the Acoustical Society of America, 120, No. 2, 750-761 (2006)
- Pradeep Dixit, Jianmin Miao, "Aspect ratio dependent copper electrodeposition technique for very high aspect ratio through-hole plating", Journal of The Electrochemical Society, 153 (6), G552-G559, 2006
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