PEOPLE

Chee Wee Tan

Academic Preparation:

Appointments:

2008 - Present: Research Engineer, CENSAM, SMART Centre
2005 - 2008: Research Associate, Micromachines Centre, School of Mechanical & Aerospace Engineering, Nanyang Technological University
2002 - 2003: Motor Engineer, Mechanical Component Group, Component Engineering Department, Maxtor Peripherals (S) Pte Ltd
2000 - 2001: Process Engineer, Final Assembly Department, Inkjet Manufacturing Singapore, Hewlett-Packard Singapore (Pte) Ltd
1996 - 1997: Technical Specialist. Wafer Fabrication Department, Inkjet Manufacturing Singapore, Hewlett-Packard Singapore (Pte) Ltd

Honors:

Top M.Sc. (Precision Engineering) graduate, Nanyang Technological University, 2005
Diploma with Merit, Singapore Polytechnic, 1994
Motorola Prize, Singapore Polytechnic, 1994
Pesi B Davar Memorial Scholarship, Singapore Polytechnic, 1991 - 1994

Four Recent Publications:

Zhihong Wang, Jianmin Miao, Chee Wee Tan and Ting Xu, "Fabrication of piezoelectric MEMS devices - From thin film to bulk PZT wafer," Journal of Electroceramics, In Press (2008)
Chee Wee Tan, Zhihong Wang, Jianmin Miao and Xiaofeng Chen, "A study on the viscous damping effect for diaphragm-based acoustic MEMS applications," Journal of Micromechanics and Microengineering 17, No. 11, pp. 2253-2263 (2007)
Pradeep Dixit, Chee Wee Tan, Luhua Xu, Nay Lin, Jianmin Miao, John H. L. Pang, Petra Backus and Robert Preisser, "Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating," Journal of Micromechanics and Microengineering 17, No. 5, pp. 1078-1086 (2007)
Chee Wee Tan and Jianmin Miao, "Analytical modeling for bulk-micromachined condenser microphone," Journal of the Acoustical Society of America 120, No. 2, pp. 750-761 (2006)

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